接着剤組成物、回路接続用接着剤、接続体及び半導体装置

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive composition which ensures sufficiently high adhesion strength even when a circuit member is connected at a low temperature in a short time, and to provide an adhesive for circuit connection using the composition, a connected product, and a semiconductor device. <P>SOLUTION: The adhesive composition contains: (a) a thermoplastic resin; (b) a radical polymerizable compound having at least two (meth)acryloyl groups in the molecule; (c) a radical polymerization initiator; and (d) a silane coupling agent having a thiourethane bond and an alkoxysilyl group in the molecule. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

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